Thermexit™-EI-20

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Application
Consumer Electronics, Power Supplies, Automotive Electronics, LED, LCD and Optical Displays, Motor Controls, High Power Density Semiconductors, Batteries and Energy Storage Devices
Description
Nanoramic Thermexit™ is a line of high-end thermal interface gap filler pads. Nanoramic's® gap fillers are a non-reactive, non-silicon, no cure system featuring high thermal conductivity and high thermal stability. Nanoramic® produces 2 novel product lines, a High Performance TIM Gap Filler and an Electrically Insulating TIM Gap Filler.
The Nanoramic Thermexit™ technology is derived from years of government funded research and development in advanced materials including the application of carbon nanotubes in electrochemical systems as well as dispersion, compounding and coating process for composites of nanotubes and other carbons. Based on a deep knowledge of nanocarbon materials, processes, and applications, Nanoramic® has demonstrated success in polymer-based composites, thermal interface materials, and binderless electrodes for energy storage.
Key features:
- Non-silicone, non-reactive, no-cure system (no resin-filler separation or unconsumed reactant outgassing)
- Easy pick and place application (naturally sticky) without residue/mess
- Highly compressible to minimize contact resistance without high force and component stress
- High breakdown voltage

Product Properties

Conductivity
>20 W/mK
Operating temperatue
°C
>150

Packaging

Pricing

Unit
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Currency
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Value
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Documents

Product Champions

General Info

Listing Type
Product
Published
May 19, 2021
Last Edited
May 19, 2021
Categories
Engineered Materials
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